Lub Nto-Mounted Device (SMD), Chip- ntawm-Board (COB), thiab Chip-Scale Package (CSP) technologies yog qhov tseem ceeb hauv kev tsim kom muaj kev ua tau zoo, kev ua tau zoo, thiab kev lees paub ntawm LEDs rau ntau yam kev siv. Vim tias txhua txoj hauv kev yog qhov tshwj xeeb ntawm nws lub cev hneev taw, lub teeb tso zis, kev tswj xyuas thermal, thiab tsim qauv, nws yog qhov zoo tshaj plaws rau qee qhov kev siv. Kev ntsuam xyuas tag nrho ntawm lawv qhov sib txawv thiab kev siv zoo tshaj plaws yog muab hauv qab no.
Disparities nyob rau hauv cov qauv thiab tsim
Nto-Mounted Device, los yog SMD
SMD LEDs yog tsim los ntawm kev txuas ncaj qha rau ib tus neeg LED chips rau lub rooj tsav xwm luam tawm (PCB). Ib lub hnab yas los yog resin ntim encasing txhua nti tiv thaiv lub semiconductor thiab ntxiv phosphor txheej los hloov cov xim tso zis. Modular configurations yog ua tau los ntawm soldering ntawm cov chips rau lub PCB nto.
Cov cwj pwm tseem ceeb:
Discrete, ntawm nws tus kheej nyob qhov chaw nyob hauv ib qho system modular.
Ntau -chip kev npaj (xws li kev sib xyaw xim liab, ntsuab, thiab xiav diodes hauv ib pob) yog sib xws.
nyob ntawm PCB kom dissipate tshav kub thiab muab hluav taws xob sib txuas.
Chip- ntawm -Board, lossis COB
Yog tsis muaj kev ntim khoom cais, COB LEDs muab ntau cov chips LED ncaj nraim mus rau lub substrate, xws li cov hlau -core PCB lossis ceramic. Txhawm rau tsim ib qho teeb pom kev zoo -emitting nto, cov chips txuas nrog hauv pawg thiab coated nrog ib txheej ntawm phosphor.
Cov cwj pwm tseem ceeb:
kev npaj ntawm high - chips ceev nyob rau hauv ib qho module.
Txhawm rau kom muaj txiaj ntsig zoo ntawm cov cua sov, qhov ncaj qha thermal channel txuas cov chips mus rau substrate.
uniform illumination nrog me ntsis hotspots los yog ntxoov ntxoo.
Chip-Sale Package, los yog CSP
Los ntawm encasing lub LED nti nyob rau hauv ib tug tiv thaiv npog uas tsuas yog marginally loj tshaj lub semiconductor nws tus kheej, CSP LEDs txo qhov loj ntawm pob. Kev sib txuas ncaj qha rau PCB yog ua tau los ntawm kev tsim cov kev tshem tawm cov qauv txhuas thiab cov xov hlau.
Cov cwj pwm tseem ceeb:
me me hneev taw-yuav luag me me li cov liab qab LED nti.
shortened hluav taws xob thiab thermal txoj kev rau kev txhim kho efficiency.
txo kev siv cov khoom siv, txo qhov poob ntawm qhov muag, thiab nce kev ua tau zoo.
Kev tsis sib xws hauv kev ua haujlwm thiab kev ua haujlwm
Efficiency thiab Light Output
SMD: Vim tias qhov kev ncua deb ntawm cov chips ib leeg, nws muab qhov nruab nrab lumen ceev. Nws cov modularity txwv qhov siab tshaj plaws ci nyob rau hauv me me qhov chaw, txawm tias nws yooj yim rau xim sib tov.
COB: Los ntawm khov kho cov chips, nws muab lub lumen siab ceev thiab teeb pom kev zoo ib yam. Rau cov concentrated, siab - siv cov kev siv, kev sib xyaw tsim optimizes lub teeb tso zis rau ib cheeb tsam.
CSP: Strikes qhov sib npaug ntawm qhov me me thiab siab lumen ceev. Vim nws qhov me me, nws tuaj yeem siv rau hauv cov txheej txheem PCB tuab thiab ua tiav COB-zoo li ci ci hauv cov qauv me me.
Thermal Control
SMD: Lub thermal conductivity ntawm PCB txiav txim siab npaum li cas cov cua sov dissipated. Yog tsis muaj kev ntsuas cua txias txaus, qhov siab - qhov chaw ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom.
Vim tias COBs ncaj qha sib txuas rau siab -conductivity substrates, xws li ceramics, uas muaj txiaj ntsig zoo tshaj tawm cov cua sov tawm ntawm cov chips, lawv ua tau zoo hauv kev ua haujlwm thermal.
CSP: Txawm hais tias nws qhov me me, nws txhim kho cov cua sov los ntawm kev siv cov thermal luv luv los ntawm cov nti mus rau PCB.
Kev tswj thiab kev sib haum xeeb hauv xim
Vim hais tias ib tug neeg tej zaum yuav sib tov los yog tweaked (xws li, RGB configurations), SMD yog superior rau dynamic xim daim ntaub ntawv.
COB: Muab cov xim zoo sib xws, tab sis tsuas yog txwv rau ib qho - xim tso tawm vim yog cov txheej txheem phosphor.
Txawm hais tias nws tuaj yeem txhawb kev teeb tsa ib leeg lossis ntau xim, CSP tsis tuaj yeem hloov kho dua li SMD thaum nws los txog rau kev sib xyaw xim sib xyaw.
SMD LEDs nrog Daim Ntawv Thov -Txhim kho kom haum
Thaum muaj xwm txheej hu rau kev hloov pauv, hloov pauv, thiab hloov xim, SMD thev naus laus zis zoo heev. Vim tias nws qhov xwm txheej tsis sib xws, uas ua rau muaj kev tswj hwm zoo ntawm tus kheej diodes, nws zoo meej rau:
Saj zawg zog LED strips rau dynamic qhia, cove teeb pom kev zoo, thiab accent phab ntsa yog cov piv txwv ntawm cov hniav thiab architectural teeb pom kev zoo.
Consumer electronics: backlighting rau portable electronics, displays, and status indications.
Kos npe: Cov ntawv qhia uas xav tau RGB muaj peev xwm, cov ntawv tshaj tawm, thiab cov ntawv sau channel.
COB teeb
Qhov zoo sib xws, siab - siv tawm ntawm COB yog qhov zoo tagnrho rau cov ntawv thov kom muaj zog, tsom teeb pom kev zoo:
Track teeb pom kev zoo,downlights, thiabsiab -bay teebyog cov piv txwv ntawm kev lag luam thiab kev lag luam teeb pom kev zoo siv nyob rau hauv khw muag khoom thiab warehouses.
Automotive Teeb pom kev zoo: Ci ntsa iab, tsom teeb pom kev xav tau rau cov teeb pom kev zoo thiab lub teeb taws.
Txoj Kev Teeb Pom Kev: Ua tau ntev, lub zog- siv tau zoo rau pej xeem cov khoom siv.
CSP teeb
Lub compact architecture ntawm CSP ua haujlwm siab -kev ua tau zoo, qhov chaw- txwv tsis pub siv:
Wearable thiab portable gadgets muaj xws li AR/VR headsets, qoj trackers, thiab smartphone flashes.
Automotive innovations muaj xws li sab hauv ambient teeb pom kev zoo thiab me me, siab - daws teeb meem headlamps.
Advanced Displays: Ultra-thin panels rau cov neeg siv khoom siv hluav taws xob thiab micro- LED zaub.
Cov txiaj ntsig thiab qhov tsis zoo
SMD
Qhov zoo: Nqis peev, hloov tau raws li kev tswj xim, thiab yooj yim kho lossis txhim kho.
Cons: Thaum tshav kub kub teeb meem nyob rau hauv ntom layouts thiab ib tug tsawg lumen ceev tshaj COB.
COB
Qhov zoo: Lub teeb zoo ib yam, siab ci ci, thiab kev tswj xyuas thermal zoo dua.
Cons: Tsis yog- cov qauv kho tsis tau, cov nqi them ua ntej ntau dua, thiab kev xaiv xim tsawg.
CSP
Qhov zoo: Kev ua haujlwm thermal zoo dua, kev ua haujlwm siab, thiab me me.
Cons: Ntau cov txheej txheem tsim khoom nyuaj, tsis yooj yim thaum tuav.
Xaiv Tsim Kev Siv Tshuab
Peb qhov kev txiav txim siab txiav txim siab seb puas yuav siv SMD, COB, lossis CSP:
Chav txwv: COB rau siab - daim ntawv thov fais fab nrog chav txaus; CSP rau ultra- qauv tsim.
Qhov yuav tsum tau muaj kev ci ntsa iab: CSP rau siab - qhov ci ci nyob rau hauv me me; COB rau qhov siab tshaj plaws.
Xim thiab Kev Tswj Xyuas: COB / CSP rau qhov zoo li qub, zoo ib yam dawb lub teeb; SMD rau dynamic xim tshuab.
Kev cia siab rau yav tom ntej
Lub hom phiaj ntawm cov kev tshwm sim tshwm sim yog los ua ke cov thev naus laus zis zoo li no:
Kev sib xyaw ua ke ntawm miniaturization ntawm CSP nrog cov thermal efficiency ntawm COB ua rau hybrid COB-CSP tsim.
Cov substrates zoo dua: Txiav - cov khoom ntug uas txhim kho cov cua sov, xws li silicon carbide.
Integrated Smart Features: Rau IoT-npaj teeb, sensors los yog tsav tsheb yuav muab tau yooj yim muab tso rau hauv CSP tej pob khoom.
https://www.benweilight.com/ceiling-lighting/led-downlights/recessed-led-down-light- tuaj yeem- teeb-dimmable.html
