Cov lus qhia rau kev daws teeb meem LED Txoj Kev Teeb
To solve these existing problems, it is recommended that street lamp manufacturers start from basic materials and solve the problem of high-power LED heat sources from the inside out. For example, thermal adhesive plays a key role in the bonding of light-emitting components and aluminum substrates. Some manufacturers think that the thermal conductivity of thermally conductive adhesive films or thermally conductive adhesive pads is better, and the thicker the film thickness, the better, but they do not think about thermal resistance. No matter how good the thermal conductivity is, the thermal resistance of the film thickness is useless. What's more, the thermally conductive adhesive film or soft thermally conductive gasket cannot really adhere to the substrate, and there are actually many pores on the bonding surface. These pores look like hollow air pockets under an electron microscope, another form of thermal resistance. In the presence of so many thermal resistances that interfere with heat conduction, the efficiency of heat dissipation and heat conduction is virtually reduced.
Siv txoj cai thermal conductive nplaum, qhov pom zoo mos ceramic thermal conductive nplaum. Cov mos mos ceramic thermal conductive nplaum rau kev tshuaj ntsuam luam ntawv yog qhov sib txawv ntawm cov khoom sib txuas ib txwm siv thermal conductive nplaum zaj duab xis. Cov mos mos ceramic thermal conductive nplaum yog mos thiab semi{0}}kua. Thaum lub vijtsam luam ntawv tshuab hniav siv rau aluminium substrate, cov thermal conductive hais yuav nkag mus rau hauv lub qhov hws ntawm qhov chaw ntawm lub substrate. ua kom puv. Nyob rau hauv txoj kev no, lub dav hlau tiaj tiaj tsis muaj qhov hws yuav raug tsim, uas yuav ua tiav tag nrho rau LED epitaxial substrate. Nyob rau hauv txoj kev no, lub thermal kuj txo mus rau qhov tsawg kawg nkaus, thiab cov cua kub yuav ua tau sai sai, uas ib txwm txo qhov kub ntawm lub LED tuag, prolongs lub neej ntawm lub epitaxy thiab heev qeeb qhov tshwm sim ntawm lub teeb lwj. Tsis tas li ntawd, vim lub ductility ntawm cov mos mos ceramic thermal conductive xim siv los ntawm kev tshuaj ntsuam luam ntawv, thaum lub sij hawm kub kub ci los yog reflow, nws yuav hloov nrog thermal expansion thiab contraction ntawm aluminium substrate. Qhov kev ntxhov siab me me, thiab aluminium substrate yuav tsis raug warped, cia nyob ib leeg Yuav tawg.
Hauv kev tiv thaiv sab nraud ntawm LED teeb, nws raug nquahu kom siv cov mos mos ceramic kub dissipation xim rau LED teeb. Cov tshuaj tsuag no- hom mos ceramic thaum tshav kub kub- cov xim dissipating tuaj yeem raug txau ncaj qha rau sab nrauv ntawm LED teeb, nrog kev tsim kho yooj yim thiab kev ua haujlwm, thiab tuaj yeem hloov mus rau ntau yam duab tshav kub-dissipating cov qauv, thiab tseem tuaj yeem hloov kho rau cov xim sib txawv kom tau raws li qhov xav tau ntawm kev tsim toj roob hauv pes. Cov mos mos ceramic hais hauv cov tshuaj tsuag- hom cua sov- cov xim dissipating yog nano- ua tiav. Cov khoom zoo tsis yog tsuas yog yooj yim rau kev khiav lag luam phom, tab sis kuj ua rau cov thermally conductive hais nyob rau tib lub txheej txheej ntau ntom thiab ntom, yog li ntawd lub cheeb tsam uas kub volatilizes thiab diffuses kuj loj dua. Cia lub zog cua sov ntawm LED teeb yuav tsum tau ua sai sai. Cov mos mos ceramic cua sov- cov xim dissipating yog cov khoom siv thermosetting, uas ua raws li RoHS ib puag ncig kev tiv thaiv thiab cov qauv kev nyab xeeb. Cov txheej txheem tsim kho yog yooj yim thiab tsis tas yuav muaj cov cuab yeej tshwj xeeb. Tom qab ci, nws yog cua sov- kho thiab tuaj yeem tiv taus qhov kub siab ntawm LED rau lub sijhawm ntev yam tsis muaj kev hloov pauv zoo. LED txoj kev teeb, teeb pom kev zoo, lossis LED tshaj tawm cov ntawv tshaj tawm siv sab nraum zoov kuj tseem yuav ntsib cov kua qaub thiab alkali kev puas tsuaj los ntawm cua thiab nag, kua qaub nag noog poob, huab cua plua plav, pa taws dub, thiab lwm yam. Yog li ntawd, cov tshuaj tsuag no - hom mos ceramic kub dissipation xim yuav tsum muaj cov yam ntxwv ntawm cov kua qaub thiab alkali tsis kam. Tam sim no cov kua qaub thiab alkali tsis kam yog PH311, uas tuaj yeem tiv thaiv cov teeb pom kev zoo ntawm LED sab nraum zoov los ntawm kev tawg.
The cost structure of LED lamps and lanterns has been improved with the improvement of packaging technology, carrier board design, and heat dissipation module structure, and the quality has been continuously improved, and the cost has also decreased with the development of technology and market demand. However, there are not many manufacturers investing in material improvement, which is mainly related to the history and habits of Taiwan's industrial and commercial development. Taiwanese manufacturers are good at manufacturing process and design, and they pay less attention to the basic research and development of materials. Therefore, when it comes to solving technical problems or reducing costs, it is more inclined to purchase thinking or production management thinking. However, American and Japanese manufacturers will think from the perspective of applied materials, reduce costs, improve quality and increase profits from the perspective of innovation.
